WD at Computex 2013 Booth Tour Day 2 - Ultra Slim, High Capacity, Rugged Drives & WD Giveaway

The video presents Linus and the Linus Tech Tips team touring the Western Digital booth at Computex 2013, Day 2, with a clear emphasis on the latest storage innovations that WD is highlighting. The hosts explain how WD is extending storage capacity in increasingly thin form factors, detailing the leap from 7 mm slim drives to a new 5 mm ultra-slim design and the 2.5 mm micro-package approach. They illustrate how the 7 mm and 5 mm drives can hold substantial data, with examples like a 1 TB drive in a 7 mm form factor and a 500 GB drive in a 5 mm chassis, achieved by reducing the bottom PCB footprint and replacing metal covers with a plastic top coating. The segment also contrasts traditional drives with rugged and shock-resistant designs, showing how the new architecture improves durability, including demonstrations of drop tests on tablets and the ability to play back media while the heads are parked. In addition to traditional HDDs, the video introduces hybrid solid-state drives that integrate flash memory (8–24 GB) with spinning platters, enabling larger capacity options in compact packages and highlighting current OEM availability. The presenters emphasize the engineering breakthroughs that reduce thickness while increasing robustness, including dual-stage actuators and minimized PCB routing that frees space for more platters, which enables up to 1 TB in a slim 7 mm form factor and notable rugged performance for mobile and compact devices. The tour concludes with a recap of day-two WD drive highlights, reiterating the focus on ultra-slim and slim drives in 500 GB to 1 TB capacities and teasing continued Computex coverage and upcoming WD videos for giveaway opportunities.

Topics · technology · hardware · storage · computex